Prodotto
G-View 400CM
Noncontact Imaging WSI & CMM
# Product Name: [ G-View400CM ]
G-View 400CM is a fine-shape measurement device using a noncontact scanning white light interference principles of the height measurement is possible to measure the nano-scale, and the binarized image by scanning white light interference due to the existing image processing is to remove the interference pattern, but not the interference pattern Dimensioning according offers innovative features that are available at the same time.
Without the movement of materials from the same place two-dimensional and three-dimensional measurement is possible and, to a distance of composite materials is measurable facilities.Customers to cost, time and space, and maximize the value of the complex equipment.
# Product Name: [ G-View400CM ]
G-View 400CM is a fine-shape measurement device using a noncontact scanning white light interference principles of the height measurement is possible to measure the nano-scale, and the binarized image by scanning white light interference due to the existing image processing is to remove the interference pattern, but not the interference pattern Dimensioning according offers innovative features that are available at the same time.
Without the movement of materials from the same place two-dimensional and three-dimensional measurement is possible and, to a distance of composite materials is measurable facilities.Customers to cost, time and space, and maximize the value of the complex equipment.
Prezzo di Prodotto
Prezzo non indicato
Dettagli tecnici
# Main Features
-Depending on the reflectivity of the sample to provide an innovative function for selecting the reflectivity of the reference mirror.
-Provide an innovative function that can be selected according to the illumination color of the sample.
-Provide a coaxial illumination, ring illumination, anticline lighting.
-The user automatically. Manually measuring and analysis is possible.
-The location provides automatic checking and correction functions.
-Automatic check-ins provide height.
# Measurement Application
-OLED Substrate-Coining Bump on advanced IC Packages
-Precise glass components (Micro Lens)
-MEMS-Laser marks on semiconductor wafer
-PCB Substrate(FC-BGA, CSP, SIP)
-Surface micromachining
-Depending on the reflectivity of the sample to provide an innovative function for selecting the reflectivity of the reference mirror.
-Provide an innovative function that can be selected according to the illumination color of the sample.
-Provide a coaxial illumination, ring illumination, anticline lighting.
-The user automatically. Manually measuring and analysis is possible.
-The location provides automatic checking and correction functions.
-Automatic check-ins provide height.
# Measurement Application
-OLED Substrate-Coining Bump on advanced IC Packages
-Precise glass components (Micro Lens)
-MEMS-Laser marks on semiconductor wafer
-PCB Substrate(FC-BGA, CSP, SIP)
-Surface micromachining
