Multilayer Ml8–Logic and power on same pcb with fine pitch di CISTELAIER S.P.A.
Prodotto
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A
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Descrizione di Prodotto
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A
Finishing: Enig