Multilayer Ml8–Logic and power on same pcb with fine pitch - Prodotto
MODENA -
Italia
Application:
Automotive hybrid car
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A
...
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A
...
Descrizione di Prodotto
Application:
Automotive hybrid car
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A
Finishing: Enig
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A
Finishing: Enig
Prezzo di Prodotto
Prezzo non indicato
